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Scientist – Advanced Packaging

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Description:

This position deals with the design and development of advanced interconnection and packaging scheme for electronic devices.  With emphasis on Micro-bump, Through Silicon Via (TSV), Through Silicon Interposer (TSI) and embedded wafer level packaging (EWLP).

 

Responsibilities

The key responsibility will include micro-joint design using solder and Cu pillar, 3D/2.5D packaging development with TSV/TSI , etc.  Process integration for advanced packaging using Through Silicon Via, Multiple die stacking, RDL & Bumping.

 

Requirements

  • PhD degree in Mechanical engineering or Material Science
  • Hand-on experience in wafer level processes, such as RDL & bumping, TSV processes, and packaging assembly processes, such as Flip-chip, underfilling, compression molding processes
  • Extensive knowledge of advanced packaging, such as Embedded wafer level packaging, TSV/TSI
  • Excellent communication skills and teamwork with strong self-motivation
  • Experience in project scoping and execution
To apply:
Interested applicants please send detailed CV to personnel@ime.a-star.edu.sg
When you apply, please mention that you saw this job on jobs.phds.org.
Employer:
The Institute of Microelectronics (IME) is a member of the Agency for Science, Technology and Research (A*STAR). Established in 1991 and ISO-9001 certified, IME's mission is to increase value-add to the electronics industry in Singapore by engaging in relevant R&D in strategic fields of microelectronics; supporting and partnering the electronics industry; and developing skilled R&D personnel.

R&D at IME covers the semiconductor technology chain, viz integrated circuit design, wafer fabrication process technology, packaging and assembly, and reliability testing and analysis.


For more information, please visit our website at http://www.ime.a-star.edu.sg