Develop wafer level hermetic/vacuum encapsulation technology for MEMS devices.
Design and run experiments for packaging process module development and process integration
Characterize MEMS packaging, reliability testing and failure analysis
Document packaging results and provide design rules for wafer level MEMS packaging
Train MEMS consortium members on MEMS packaging
Interface with assignees for process integration activities
PhD Degree in Mechanical, Electrical or Material Engineering with 4-5 years of industrial experience
Hands-on experience on wafer level MEMS packaging related works, including microfabrication process, wafer bonding with different material etc.
Knowledge in MEMS design, electrical and mechanical modeling
Excellent communication skills and teamwork with strong self-motivation
If you have the PASSION for research, we invite you to be part of our dynamic team. If you are interested, please send us a detailed copy of your resume in English, including the list of publications and patents to email@example.com
When you apply, please mention that you saw this job on jobs.phds.org.
The Institute of Microelectronics (IME) is a member of the Agency for Science, Technology and Research (A*STAR). Established in 1991 and ISO-9001 certified, IME's mission is to increase value-add to the electronics industry in Singapore by engaging in relevant R&D in strategic fields of microelectronics; supporting and partnering the electronics industry; and developing skilled R&D personnel.
R&D at IME covers the semiconductor technology chain, viz integrated circuit design, wafer fabrication process technology, packaging and assembly, and reliability testing and analysis.